Form of presentation | Articles in international journals and collections |
Year of publication | 2022 |
Язык | английский |
|
Latipov Zagir Azgarovich, author
|
Bibliographic description in the original language |
Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads
Supriyono, Chen, T.-C., Yapanto, L.M., ...Repnikov, N.I., Arzehgar, Z.
Soldering and Surface Mount Technology, 2022, 34(1), str. 58–65 |
Keywords |
Reliability, modeling |
The name of the journal |
Soldering and Surface Mount Technology
|
URL |
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85112565842&doi=10.1108%2fSSMT-04-2021-0014&partnerID=40&md5=5ce494a87e41603f233362d971f6e0fe |
Please use this ID to quote from or refer to the card |
https://repository.kpfu.ru/eng/?p_id=260077&p_lang=2 |
Full metadata record ![](https://shelly.kpfu.ru/pdf/picture/arrow_black_right.gif) |
Field DC |
Value |
Language |
dc.contributor.author |
Latipov Zagir Azgarovich |
ru_RU |
dc.date.accessioned |
2022-01-01T00:00:00Z |
ru_RU |
dc.date.available |
2022-01-01T00:00:00Z |
ru_RU |
dc.date.issued |
2022 |
ru_RU |
dc.identifier.citation |
Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads
Supriyono, Chen, T.-C., Yapanto, L.M., ...Repnikov, N.I., Arzehgar, Z.
Soldering and Surface Mount Technology, 2022, 34(1), стр. 58–65 |
ru_RU |
dc.identifier.uri |
https://repository.kpfu.ru/eng/?p_id=260077&p_lang=2 |
ru_RU |
dc.description.abstract |
Soldering and Surface Mount Technology |
ru_RU |
dc.language.iso |
ru |
ru_RU |
dc.subject |
Reliability |
ru_RU |
dc.subject |
modeling |
ru_RU |
dc.title |
Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads |
ru_RU |
dc.type |
Articles in international journals and collections |
ru_RU |
|