KFU. Card publication. Effect of thermal cycle loadings on mechanical properties and thermal conductivity of a porous lead-free solder joint

KAZAN
FEDERAL UNIVERSITY

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EFFECT OF THERMAL CYCLE LOADINGS ON MECHANICAL PROPERTIES AND THERMAL CONDUCTIVITY OF A POROUS LEAD-FREE SOLDER JOINT

Form of presentation

Articles in international journals and collections

Year of publication

2018

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Authors, employees of KFU

Akhmetov Linar Gimazetdinovich, author

Bibliographic description in the original language

Surendar A, Akhmetov L.G, Ilyashenko L.K, Effect of thermal cycle loadings on mechanical properties and thermal conductivity of a porous lead-free solder joint//IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2018. - Vol., Is.. - .

Keywords

mechanical properties, porous lead-free solder joint

The name of the journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85050979217&doi=10.1109%2fTCPMT.2018.2861777&partnerID=40&md5=00f01a981755e0f44d1bc2947ce1991d

Please use this ID to quote from or refer to the card

https://repository.kpfu.ru/eng/?p_id=185304&p_lang=2

Full metadata record

Field DC	Value	Language
dc.contributor.author	Akhmetov Linar Gimazetdinovich	ru_RU
dc.date.accessioned	2018-01-01T00:00:00Z	ru_RU
dc.date.available	2018-01-01T00:00:00Z	ru_RU
dc.date.issued	2018	ru_RU
dc.identifier.citation	Surendar A, Akhmetov L.G, Ilyashenko L.K, Effect of thermal cycle loadings on mechanical properties and thermal conductivity of a porous lead-free solder joint//IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2018. - Vol., Is.. - .	ru_RU
dc.identifier.uri	https://repository.kpfu.ru/eng/?p_id=185304&p_lang=2	ru_RU
dc.description.abstract	IEEE Transactions on Components, Packaging and Manufacturing Technology	ru_RU
dc.language.iso	ru	ru_RU
dc.subject	mechanical properties	ru_RU
dc.subject	porous lead-free solder joint	ru_RU
dc.title	Effect of thermal cycle loadings on mechanical properties and thermal conductivity of a porous lead-free solder joint	ru_RU
dc.type	Articles in international journals and collections	ru_RU